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Guangzhou Xianyi Electronic Technology Co., Ltd.

Guangdong, ChinaManufacturer/Factory & Trading CompanyMember since 2024 Audited supplier

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Guangzhou Xianyi Electronic Technology Co., Ltd.

No. 12, Chuangyun Road, Shiqi Town, Panyu District, 511450 China, Guangzhou, Guangdong, China 511450

Main products: AuSn Solder Preform, Other Alloy Solder Preform, AuSn Solder Seal Lid, AuSn Solder Paste, AuSn Thin Film Heat Sink

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Ms. Jane
86-18027194837
86-20-34698382
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All products Copper Pillar Solder Preforms Tin-Based Solders Indium-Based Solders Silver-Based Solders Gold-based Preforms Flux-coated Preforms Others Solder Preforms Solder Paste Silver Sinter Paste Gold-Tin Paste Lead-Free Paste Gold-Tin Solder Seal Lids Gold-Tin Thin-Film Heat Sink AMB Ceramic Substrates Flux

+7 more groups

Solder Balls AuSn solder balls Others Solder Balls Solder Wire Gold Wire Others Solder Wire Others

All products 50 items

High Thermal Conductivity Heat Sinks for LED Lighting and Automotive Electronics

High Thermal Conductivity Heat Sinks for LED Lighting and Automotive Electronics

Extruded Aluminum Heat Sinks with Anodized Surface for Industrial Equipment

Extruded Aluminum Heat Sinks with Anodized Surface for Industrial Equipment

Pin Fin Heat Sinks for High Power IGBT Modules and Server Cpus

Pin Fin Heat Sinks for High Power IGBT Modules and Server Cpus

High Thermal Conductivity Ausn Thin Film Heat Sink for Optoelectronic Device Packaging

High Thermal Conductivity Ausn Thin Film Heat Sink for Optoelectronic Device Packaging

High-Precision Coated Heat Sink for Semiconductor Chip Heat Dissipation Packaging

High-Precision Coated Heat Sink for Semiconductor Chip Heat Dissipation Packaging

Ultra-Thin AuSn Layer Heat Sink for Micro Optoelectronic Device Packaging

Ultra-Thin AuSn Layer Heat Sink for Micro Optoelectronic Device Packaging

High Solderability Thin Film Heat Sink for SiC Power Device Packaging

High Solderability Thin Film Heat Sink for SiC Power Device Packaging

Low Thermal Resistance Ausn Heat Sink for High-Frequency RF Module Packaging

Low Thermal Resistance Ausn Heat Sink for High-Frequency RF Module Packaging

Temperature Shock Resistant Thin Film Heat Sink for Aerospace Electronic Packaging

Temperature Shock Resistant Thin Film Heat Sink for Aerospace Electronic Packaging

High Adhesion AuSn Heat Sink for Ceramic Substrate Integrated Packaging

High Adhesion AuSn Heat Sink for Ceramic Substrate Integrated Packaging

Custom Coated Heat Sink for High-Power LED Device Packaging

Custom Coated Heat Sink for High-Power LED Device Packaging

High Hermeticity Ausn Heat Sink for Mems Device Hermetic Packaging

High Hermeticity Ausn Heat Sink for Mems Device Hermetic Packaging

High Purity Thin Film Heat Sink for Fpga Chip Precision Packaging

High Purity Thin Film Heat Sink for Fpga Chip Precision Packaging

Thermal Shock Resistant Ausn Heat Sink for Vehicle Power Module Packaging

Thermal Shock Resistant Ausn Heat Sink for Vehicle Power Module Packaging

Large Size Coated Heat Sink for Power Electronic Device Packaging

Large Size Coated Heat Sink for Power Electronic Device Packaging

-Low Void Ausn Heat Sink for Third-Generation Semiconductor Packaging

-Low Void Ausn Heat Sink for Third-Generation Semiconductor Packaging

High Stability Thin Film Heat Sink for Industrial Control Chip Packaging

High Stability Thin Film Heat Sink for Industrial Control Chip Packaging

Anti-Oxidation Thin Film Heat Sink for Military Electronic Device Packaging

Anti-Oxidation Thin Film Heat Sink for Military Electronic Device Packaging

Micro Size Ausn Heat Sink for Micro Sensor Heat Dissipation Packaging

Micro Size Ausn Heat Sink for Micro Sensor Heat Dissipation Packaging

High Compatibility Ausn Heat Sink for Heterogeneous Integrated Chip Packaging

High Compatibility Ausn Heat Sink for Heterogeneous Integrated Chip Packaging

No-Clean Rosin Flux for SMT Soldering and PCB Assembly

No-Clean Rosin Flux for SMT Soldering and PCB Assembly

High Ductility Gold Bonding Wire for Microelectronic Device Interconnection

High Ductility Gold Bonding Wire for Microelectronic Device Interconnection

₹12,525 approx.

Low-Residue Flux Coated Au80sn20 Solder Preform for No-Clean Optoelectronic Packaging

Low-Residue Flux Coated Au80sn20 Solder Preform for No-Clean Optoelectronic Packaging

High Precision Aluminum Heat Sinks for Electronic Components Cooling

High Precision Aluminum Heat Sinks for Electronic Components Cooling