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High Ductility Gold Bonding Wire for Microelectronic Device Interconnection
5.0InStock Source-listed auditby Guangzhou Xianyi Electronic Technology Co., Ltd.
₹12,525≈ $150 · indicative, confirm with supplier
Payment
Description
High Ductility Gold Bonding Wire for Microelectronic Device Interconnection, Find Details and Price about Gold Wire Gold Bonding Wire from High Ductility Gold Bonding Wire for Microelectronic Device Interconnection - Guangzhou Xianyi Electronic Technology Co., Ltd.
Specifications
Width25 Um, 50 Um, 75 Um, 100 Um, 150 Um, 200 Um, etc
Thickness10 M, 12.7 Um, 25 Um, etc
TrademarkGuangzhou XianYi Electronic Technology Co., Ltd
SpecificationCustomized to meet your specific needs
Density (g/cm3)19.32
Transport PackageVacuum Packaging
Resistivity (Uo-M)0.0221
Melting Point (°C)1064
