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Guangzhou Xianyi Electronic Technology Co., Ltd.

Guangdong, ChinaManufacturer/Factory & Trading CompanyMember since 2024 Audited supplier

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Guangzhou Xianyi Electronic Technology Co., Ltd.

No. 12, Chuangyun Road, Shiqi Town, Panyu District, 511450 China, Guangzhou, Guangdong, China 511450

Main products: AuSn Solder Preform, Other Alloy Solder Preform, AuSn Solder Seal Lid, AuSn Solder Paste, AuSn Thin Film Heat Sink

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Ms. Jane
86-18027194837
86-20-34698382
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AuSn Solder Preform · Other Alloy Solder Preform · AuSn Solder Seal Lid

50 products in 23 groups, shipped from Guangdong, China. Ask for prices, MOQ and lead time to India.

Call 86-20-34698382

High Thermal Conductivity Heat Sinks for LED Lighting and Automotive Electronics

Extruded Aluminum Heat Sinks with Anodized Surface for Industrial Equipment

Pin Fin Heat Sinks for High Power IGBT Modules and Server Cpus

High Thermal Conductivity Ausn Thin Film Heat Sink for Optoelectronic Device Packaging

High-Precision Coated Heat Sink for Semiconductor Chip Heat Dissipation Packaging

Solder Preforms

Low-Residue Flux Coated Au80sn20 Solder Preform for No-Clean Optoelectronic Packaging

Low-Residue Flux Coated Au80sn20 Solder Preform for No-Clean Optoelectronic Packaging

High Purity Au80Sn20 Gold-Tin Solder Preform for Semiconductor Packaging

High Purity Au80Sn20 Gold-Tin Solder Preform for Semiconductor Packaging

₹4 approx.

Flux-Coated Solder Preforms for Simplified Soldering Process in Uniform Flux Coating

Flux-Coated Solder Preforms for Simplified Soldering Process in Uniform Flux Coating

Solder Preform In100 for Low Temperature Indium-Based Solder in Laser Diode Applications

Solder Preform In100 for Low Temperature Indium-Based Solder in Laser Diode Applications

Solder Preform In97Ag3 for Low Temperature Lead-Free Solder in Indium-Silver Preform

Solder Preform In97Ag3 for Low Temperature Lead-Free Solder in Indium-Silver Preform

Solder Preform Pb92.5sn5AG2.5 for High Temperature High Power Electronic Lead-Tin-Silver

Solder Preform Pb92.5sn5AG2.5 for High Temperature High Power Electronic Lead-Tin-Silver

Solder Preform Sn63pb37 for Aerospace Electronic Assembly in Lead-Containing Solder

Solder Preform Sn63pb37 for Aerospace Electronic Assembly in Lead-Containing Solder

Solder Preform Ag72Cu28 for Electronic Assembly in Silver-Copper Soldering

Solder Preform Ag72Cu28 for Electronic Assembly in Silver-Copper Soldering

Tin-Based Solders

Gold-Tin Solder Seal Lids for Simplified Packaging Process in Ausn Hermetic Packaging System

Gold-Tin Solder Seal Lids for Simplified Packaging Process in Ausn Hermetic Packaging System

Solder Paste SAC305 for Electronic Brazing Under Sn96.5Ag3Cu0.5 Tin-Silver-Copper Solder Alloy

Solder Paste SAC305 for Electronic Brazing Under Sn96.5Ag3Cu0.5 Tin-Silver-Copper Solder Alloy

₹1,670 approx.

Solder Paste Au78Sn22 for Printing and Dispensing Process Under Gold-Tin Eutectic Solder Alloy

Solder Paste Au78Sn22 for Printing and Dispensing Process Under Gold-Tin Eutectic Solder Alloy

₹10,855 approx.

Solder Paste Au80Sn20 for Printing and Dispensing Process Under Gold-Tin Eutectic Solder Alloy

Solder Paste Au80Sn20 for Printing and Dispensing Process Under Gold-Tin Eutectic Solder Alloy

₹10,855 approx.

Gold-Tin Thin-Film Heat Sink

High Thermal Conductivity Ausn Thin Film Heat Sink for Optoelectronic Device Packaging

High Thermal Conductivity Ausn Thin Film Heat Sink for Optoelectronic Device Packaging

Ultra-Thin AuSn Layer Heat Sink for Micro Optoelectronic Device Packaging

Ultra-Thin AuSn Layer Heat Sink for Micro Optoelectronic Device Packaging

High Solderability Thin Film Heat Sink for SiC Power Device Packaging

High Solderability Thin Film Heat Sink for SiC Power Device Packaging

Temperature Shock Resistant Thin Film Heat Sink for Aerospace Electronic Packaging

Temperature Shock Resistant Thin Film Heat Sink for Aerospace Electronic Packaging

High Purity Thin Film Heat Sink for Fpga Chip Precision Packaging

High Purity Thin Film Heat Sink for Fpga Chip Precision Packaging

High Stability Thin Film Heat Sink for Industrial Control Chip Packaging

High Stability Thin Film Heat Sink for Industrial Control Chip Packaging

Anti-Oxidation Thin Film Heat Sink for Military Electronic Device Packaging

Anti-Oxidation Thin Film Heat Sink for Military Electronic Device Packaging

Gold-Tin Thin-Film Heatsink Submount for Laser Diode, Power Semiconductor with Ausn Layer

Gold-Tin Thin-Film Heatsink Submount for Laser Diode, Power Semiconductor with Ausn Layer

More from this supplier

All 50 products

High Thermal Conductivity Heat Sinks for LED Lighting and Automotive Electronics

High Thermal Conductivity Heat Sinks for LED Lighting and Automotive Electronics

Extruded Aluminum Heat Sinks with Anodized Surface for Industrial Equipment

Extruded Aluminum Heat Sinks with Anodized Surface for Industrial Equipment

Pin Fin Heat Sinks for High Power IGBT Modules and Server Cpus

Pin Fin Heat Sinks for High Power IGBT Modules and Server Cpus

High-Precision Coated Heat Sink for Semiconductor Chip Heat Dissipation Packaging

High-Precision Coated Heat Sink for Semiconductor Chip Heat Dissipation Packaging

Low Thermal Resistance Ausn Heat Sink for High-Frequency RF Module Packaging

Low Thermal Resistance Ausn Heat Sink for High-Frequency RF Module Packaging

High Adhesion AuSn Heat Sink for Ceramic Substrate Integrated Packaging

High Adhesion AuSn Heat Sink for Ceramic Substrate Integrated Packaging

Custom Coated Heat Sink for High-Power LED Device Packaging

Custom Coated Heat Sink for High-Power LED Device Packaging

High Hermeticity Ausn Heat Sink for Mems Device Hermetic Packaging

High Hermeticity Ausn Heat Sink for Mems Device Hermetic Packaging

Thermal Shock Resistant Ausn Heat Sink for Vehicle Power Module Packaging

Thermal Shock Resistant Ausn Heat Sink for Vehicle Power Module Packaging

Large Size Coated Heat Sink for Power Electronic Device Packaging

Large Size Coated Heat Sink for Power Electronic Device Packaging

-Low Void Ausn Heat Sink for Third-Generation Semiconductor Packaging

-Low Void Ausn Heat Sink for Third-Generation Semiconductor Packaging

Micro Size Ausn Heat Sink for Micro Sensor Heat Dissipation Packaging

Micro Size Ausn Heat Sink for Micro Sensor Heat Dissipation Packaging

Product groups (23)

Copper Pillar Solder Preforms Tin-Based Solders Indium-Based Solders Silver-Based Solders Gold-based Preforms Flux-coated Preforms Others Solder Preforms Solder Paste Silver Sinter Paste Gold-Tin Paste Lead-Free Paste Gold-Tin Solder Seal Lids Gold-Tin Thin-Film Heat Sink AMB Ceramic Substrates Flux Solder Balls AuSn solder balls Others Solder Balls Solder Wire Gold Wire Others Solder Wire Others

Company profile

Guangzhou Xianyi Electronic Technology Co., Ltd. is listed as a manufacturer/factory & trading company in Guangdong, China, established 2008.

Business Type: Manufacturer/Factory & Trading Company
Year Established: 2008
Employees: 134
Registered Capital: 17,234,900 RMB
Nearest Port: Guangzhou Port
Min. Order: 2000RMB

Main Markets: Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Domestic

Main Products: AuSn Solder Preform, Other Alloy Solder Preform, AuSn Solder Seal Lid, AuSn Solder Paste, AuSn Thin Film Heat Sink

OEM/ODM ServiceSample AvailableVisit My Factory

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Contact: Ms. Jane
Telephone: 86-20-34698382
Mobile: 86-18027194837

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