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CategoriesIndustrial Equipment & ComponentsWelding & Soldering SuppliesOther Welding & Soldering Supplies-Low Void Ausn Heat Sink for Third-Generation Semiconductor Packaging

-Low Void Ausn Heat Sink for Third-Generation Semiconductor Packaging

Name: -Low Void Ausn Heat Sink for Third-Generation Semiconductor Packaging
Brand: Guangzhou Xianyi Electronic Technology Co., Ltd.
SKU: yRGrQoDZfskC
Price: 251 INR

5.0InStock Source-listed auditby Guangzhou Xianyi Electronic Technology Co., Ltd.

₹251≈ $3 · indicative, confirm with supplier

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Description

-Low Void Ausn Heat Sink for Third-Generation Semiconductor Packaging, Find Details and Price about High Precision Heat Sinks Semiconductor Packaging Heat Sink from -Low Void Ausn Heat Sink for Third-Generation Semiconductor Packaging - Guangzhou Xianyi Electronic Technology Co., Ltd.