High Stability Thin Film Heat Sink for Industrial Control Chip Packaging

High Stability Thin Film Heat Sink for Industrial Control Chip Packaging. High Stability Thin Film: Designed for industrial control chip packaging with high stability performance. Custom Substrate Options: Available in AlN, Al2O3, WCu, MoCu, Quartz, Si, and other materials. Custom Metallization Layers: Options include Ti/PT/Au, Ti/Ni/Au, and other customized layer structures. National High-Tech Enterprise: Established in 2008, recognized as a national 'Little Giant' enterprise. ISO Certified Quality: Certified with ISO9001:2015 and ISO14001 for reliable manufacturing standards. 100% Product Inspection: Every finished product undergoes strict functional and visual inspection. Fast Sample Delivery: Samples can be delivered within 2-3 days for quick testing and evaluation. Direct Manufacturer: Factory direct sales with 18 years of experience in microelectronic packaging.