High Purity Au80Sn20 Gold-Tin Solder Preform for Semiconductor Packaging

High Purity Au80Sn20 Gold-Tin Solder Preform for Semiconductor Packaging. High Shear Strength: Shear strength exceeds 20MPa for reliable semiconductor packaging. Uniform Flowability: Ensures uniform spreading during the soldering process. Established Manufacturer: 18 years of experience in solder preforms and microelectronic packaging. National High-Tech Enterprise: Recognized as a national 'Little Giant' for high-reliability materials. 100% Quality Inspection: Finished products undergo both functional and visual inspections. Flexible Customization: Offers full, minor, and flexible customization from samples or designs. Fast Delivery: Samples delivered in 2-3 days; bulk orders in 2-3 weeks.