Loading…
High Thermal Conductivity Ausn Thin Film Heat Sink for Optoelectronic Device Packaging
5.0InStock Source-listed auditby Guangzhou Xianyi Electronic Technology Co., Ltd.
₹251≈ $3 · indicative, confirm with supplier
Description
High Thermal Conductivity Ausn Thin Film Heat Sink for Optoelectronic Device Packaging, Find Details and Price about High Precision Heat Sinks and Device Packaging Heat Sink from Guangzhou Xianyi Electronic Technology Co., Ltd.
Specifications
Model NO.Customized to meet your specific needs
CustomizationAvailable
Transport PackageVacuum Packaging
Substrate MaterialAin, Ai203, Wcu, Mocu, Quartz, Si, etc
Metallization LayerTi/PT/Au, Ti/Ni/Au, etc.
