Pin Fin Heat Sinks for High Power IGBT Modules and Server Cpus

Pin Fin Heat Sinks for High Power IGBT Modules and Server Cpus. Custom Substrate Materials: Available in AlN, Al2O3, W-Cu, Mo-Cu, Quartz, Si, and other materials. Custom Metallization Layers: Options include Ti/Pt/Au, Ti/Ni/Au, and other customized metallization. High Power Application: Specifically designed for high power IGBT modules and server CPUs. National High-Tech Enterprise: Established in 2008, specializing in high-reliability microelectronic packaging. 100% Quality Inspection: Finished products undergo both functional and visual inspection. Fast Sample Delivery: Samples can be delivered within 2-3 days for testing purposes. Professional Technical Support: Provided by 9 R&D engineers and professional sales services. Flexible Customization: Supports customization from samples, designs, and flexible minor adjustments.