High Hermeticity Ausn Heat Sink for Mems Device Hermetic Packaging

High Hermeticity Ausn Heat Sink for Mems Device Hermetic Packaging. High Hermeticity Packaging: Specialized heat sink designed for MEMS device hermetic packaging applications. Custom Substrate Materials: Available in AlN, Al2O3, W-Cu, Mo-Cu, Quartz, Si, and other materials. Flexible Metallization: Options include Ti/Pt/Au and Ti/Ni/Au layers for specific bonding needs. National High-Tech Enterprise: Recognized 'Little Giant' with over 18 years of manufacturing experience. 100% Quality Inspection: Finished products undergo both functional and visual inspection before shipment. Fast Sample Delivery: Samples can be delivered within 2-3 days for immediate testing. ISO Certified Manufacturer: Certified under ISO9001:2015 and ISO14001 for quality and environmental management. Full Customization Support: Offers customization from samples, designs, and flexible minor adjustments.