Ultra-Thin AuSn Layer Heat Sink for Micro Optoelectronic Device Packaging

Ultra-Thin AuSn Layer Heat Sink for Micro Optoelectronic Device Packaging. Custom Substrate Options: Available substrates include AlN, Al2O3, W-Cu, Mo-Cu, Quartz, and Si. Flexible Metallization: Metallization layers can be customized, such as Ti/Pt/Au or Ti/Ni/Au. National High-Tech Enterprise: Recognized as a national 'Little Giant' with over 18 years of experience. 100% Quality Inspection: Finished products undergo both functional and visual inspections before shipment. ISO Certified Quality: Manufacturing process certified under ISO9001:2015 and ISO14001 standards. Fast Sample Delivery: Samples can be delivered within 2-3 days for immediate testing needs. Professional Technical Support: Provides professional technical consultations and suitable process solutions. Direct Manufacturer Pricing: Factory-direct sales ensure better prices and good quality reputation.