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CategoriesIndustrial Equipment & ComponentsWelding & Soldering SuppliesOther Welding & Soldering SuppliesHigh Solderability Thin Film Heat Sink for SiC Power Device Packaging

High Solderability Thin Film Heat Sink for SiC Power Device Packaging

Name: High Solderability Thin Film Heat Sink for SiC Power Device Packaging
Brand: Guangzhou Xianyi Electronic Technology Co., Ltd.
SKU: DYTUHbiKgsWE
Price: 251 INR

5.0InStock Source-listed auditby Guangzhou Xianyi Electronic Technology Co., Ltd.

₹251≈ $3 · indicative, confirm with supplier

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High Solderability Thin Film Heat Sink for SiC Power Device Packaging, Find Details and Price about High Precision Heat Sinks Device Packaging Heat Sink from High Solderability Thin Film Heat Sink for SiC Power Device Packaging - Guangzhou Xianyi Electronic Technology Co., Ltd.