Service Manufacturer, Electronic Components, IC Electronic Components Supplier - Fuzhou Xinxu Technology Co., Ltd

Company profile

Service Manufacturer, Electronic Components, IC Electronic Components Supplier - Fuzhou Xinxu Technology Co., Ltd is listed as a manufacturer/factory.

Business Type

Manufacturer/Factory

Main Products: Service, Electronic Components, More, Company Introduction, Production Capacity, Fuzhou Xinxu Technology Co., Ltd. Was established from 2022 to September 21. Address: Workshop 12 #, No. 28, Linsen Avenue, Qianfeng Town, Minhou County, Fuzhou City, Fujian Province. Our company is a national high-tech enterprise, a national "specialized, special, new and small giant" enterprise, a provincial innovative enterprise, a provincial leader in small, medium-sized and micro science and ..., Fuzhou Xinxu Technology Co., Ltd. Was established from 2022 to September 21. Address: Workshop 12 #, No. 28, Linsen Avenue, Qianfeng Town, Minhou County, Fuzhou City, Fujian Province. Our company is a national high-tech enterprise, a national "specialized, special, new and small giant" enterprise, a provincial innovative enterprise, a provincial leader in small, medium-sized and micro science and technology, a provincial research center for Enterprise engineering technology of ceramic packaging materials, an enterprise with intellectual property advantages in Fujian Province, a municipal enterprise technology center, and a military electronic packaging mobilization center in Nanping City, Fujian Province. At present, the company is mainly engaged in the production and research and development of Electroceramics, microelectronic packaging products and LED lighting products. Many products have won national, provincial and municipal scientific research achievement awards; The surface mounted integrated circuit low-temperature glass packaging shell was rated as a national key new product and a provincial excellent new product in 2008. The company has 3 national invention patents, 34 utility model patents, and 2 exterior design patents. The electronic packaging covers produced by the company are widely used in crystal oscillators, resonators, surface acoustic wave filters (SAW), and integrated circuits. The products are sold nationwide and exported worldwide. Integrated circuit black ceramic low-temperature glass packaging shells (CERDIP and CFP) are important domestic manufacturers, mainly used in military, automotive, medical equipment, and microelectronic packaging with high quality and reliability requirements. Our products are sold to more than ten provinces, cities, and autonomous regions, including Beijing, Shanghai, Shenzhen, Chongqing, Xi'an, Jiangsu, Gansu, Liaoning, Hunan, and Guizhou. In 2015, the company invested 10 million yuan in the new CFP packaging shell and lead frame project, supplying products to multiple countries such as the United States., More, , Less, 

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