Main products
Polish Abrasive, Lapato Abrasive, Diamond Abrasive, Cut Saw Blade, Diamond Roller, Nano Pad, Resin Abrasive, Squaring Wheel, Chamfering Wheel, Ceramic Tiles Polish Machine, More, Company Introduction, Trade Capacity, Production Capacity, Foshan HongCheng New Material Technology Co., Ltd. Was established in 2010, is a professional engaged in ceramic and stone polishing abrasive products and precision ceramic machine automation equipment R &D company, the company set design, production, sales and service as a whole, the company has a group of professional R &D personnel, outstanding management personnel and after-sales service ..., Foshan HongCheng New Material Technology Co., Ltd. Was established in 2010, is a professional engaged in ceramic and stone polishing abrasive products and precision ceramic machine automation equipment R & D company, the company set design, production, sales and service as a whole, the company has a group of professional R & D personnel, outstanding management personnel and after-sales service team. We have been committed to the different uses of the diamond abrasive and ceramic industry precision ceramic machine automation equipment resarch research, development, production. The company adhering to the"people-oriented, technological innovation, excellence"business philosophy, and formed a product development, manufacturing, export trade, after-sarvice as the core of the modern enterprise management system., The company's automation of precision ceramic equipment manufacturing research and development has a unique view, to provide customers with personalizd product solutions to meet the needs of the product's excellent quality and provide a strong technical support. In the introduction of the latest technology in the world as well we do technical adjustments and re innovation, never-ending quest to promote Hongcheng products into semi-automatic and full-automatic serialization implementations, making it one of the best brands of ptecision ceramic machinery equipment automation inductry., More, , Less,
