Metallographic Cold Mounting Compounds Cold Mounting Metallography Cold Mounting Epoxy Resin

Description

Metallographic Cold Mounting Compounds Cold Mounting Metallography Cold Mounting Epoxy Resin. Fast Curing Time: Curing time ranges from 13 to 15 minutes for efficient workflow. Specialized PCB Application: Suitable for PCB, semiconductor, and micro-electronic metallographic analysis. Acrylic Composition: Consists of 1kg acrylic powder and 800ml liquid hardener. Room Temperature Curing: Classified as room curing material requiring no external heat. Weatherability: Features natural polymer composition with weather-resistant properties. Full Customization: Offers full customization, minor customization, and flexible options. OEM and ODM Services: Provides both OEM and ODM services for tailored manufacturing needs. ISO9001 Certified: Manufacturer holds ISO9001:2015 management system certification.