| Color | White |
| Model NO. | RAY-RESIN |
| Application | PCB Metallographic |
| Customization | Available |
| Bonding Function | Liquid Sealing Leak |
Metallographic Cold Mounting Resin Metallurgical Cold Mounting Laboratory Used Metallographic Experiment. Specialized for PCB: Ideal for PCB, semiconductor, and micro-electronic metallographic experiments. Fast Curing Time: Complete curing in 13-15 minutes for efficient workflow. Precise Proportion: Requires a 1:0.8 ratio of acrylic powder to liquid hardener. Inorganic Composition: Made of inorganic materials in a water emulsion form. Weatherable Material: Features natural polymer characteristics with high weatherability. Customization Options: Supports full, minor, and flexible customization from samples or designs. Flexible Shipping: Options include air, sea, or customer-requested shipping methods. 100% Quality Inspection: Finished products undergo visual and functional inspection.
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