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Microcrystalline Glass Shell Qfp IC Electronic Components
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Description
Conductive Type: Normal Integration: Normal Technics: Semiconductor IC Gold Tin Composition: Ausn8020 Cladding Material: Nickel 3-8um, Gold Above 1.3um OEM: ODM
Specifications
OEMODM
shapeFlat
OriginChina
TechnicsSemiconductor IC
PackagingThe Box
IntegrationNormal
Conductive TypeNormal
Cladding MaterialNickel 3-8um, Gold Above 1.3um
Transport PackageCarton
Gold Tin CompositionAusn8020
