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DIP Encapsulated Black Ceramic 20 Wire Fusion Sealed High-Precision Semiconductor Shell
InStock Source-listed auditby Fuzhou Xinxu Technology Co., Ltd
₹295≈ $3.53 · indicative, confirm with supplier
Supplier information
Description
DIP Encapsulated Black Ceramic 20 Wire Fusion Sealed High-Precision Semiconductor Shell, Find Details and Price about IC Electronic Components High Precision Semiconductor from DIP Encapsulated Black Ceramic 20 Wire Fusion Sealed High-Precision Semiconductor Shell - Fuzhou Xinxu Technology Co., Ltd
Specifications
ShapeDIP
shapeDIP
OriginChina
TechnicsSemiconductor IC
Model NO.20
Integration1
Conductive Type1
Transport PackageCarton
