High Voltage Dbc Direct Bond Copper Alumina Substrate Used in Electronics Packaging and Power Modules

Name: High Voltage Dbc Direct Bond Copper Alumina Substrate Used in Electronics Packaging and Power Modules
Brand: Alumina Substrate Manufacturer, Alumina Ceramic Plate, Alumina Ceramic Sheet Supplier - Binzhou Aonuo New Material Technology Co., Ltd.
SKU: dQhpwFIbrlRi
Price: 3 INR

InStock Source-listed auditby Binzhou Aonuo New Material Technology Co., Ltd.

₹3≈ $0.04 · indicative, confirm with supplier

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Alumina Substrate Manufacturer, Alumina Ceramic Plate, Alumina Ceramic Sheet Supplier - Binzhou Aonuo New Material Technology Co., Ltd.

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High Voltage Dbc Direct Bond Copper Alumina Substrate Used in Electronics Packaging and Power Modules, Find Details and Price about Alumina Substrate and Alumina Ceramic Substrate from Binzhou Aonuo New Material Technology Co., Ltd.