Amb Dbc Direct Bonded Copper Ceramic Substrate for IGBT Modules with Metallized Gold Plated Copper Clad Layer, Find Details and Price about IGBT Ceramic Substrate and Amb Ceramic Substrate from Shenyang Vhandy Technology Co., Ltd.
Specifications
ProcessCustomizable
MaterialAlN
Model NO.VH
ApplicationElectronic Devices, Power Supply, Semiconductors