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Oxygen Free Copper Bonding Gasket Integrated Circuit Chip Packaging Shell
InStock Source-listed auditby Fuzhou Xinxu Technology Co., Ltd
₹17≈ $0.2 · indicative, confirm with supplier
Supplier information
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Description
Oxygen Free Copper Bonding Gasket Integrated Circuit Chip Packaging Shell, Find Details and Price about IC Electronic Components High Precision Semiconductor from Oxygen Free Copper Bonding Gasket Integrated Circuit Chip Packaging Shell - Fuzhou Xinxu Technology Co., Ltd
Specifications
shapeDIP
OriginChina
OxidizeNo Oxidation
SurfaceLevel
TechnicsSemiconductor IC
IntegrationNormal
Specification0.5mm*0.5mm
Conductive TypeNormal
Transport PackageCarton
