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IC Electronic Components Sop Packaging 8-Wire Multi-Layer Ceramic Fusion Sealed Semiconductor Shell
InStock Source-listed auditby Fuzhou Xinxu Technology Co., Ltd
₹2,088≈ $25 · indicative, confirm with supplier
Supplier information
Description
IC Electronic Components Sop Packaging 8-Wire Multi-Layer Ceramic Fusion Sealed Semiconductor Shell, Find Details and Price about IC Electronic Components High Precision Semiconductor from IC Electronic Components Sop Packaging 8-Wire Multi-Layer Ceramic Fusion Sealed Semiconductor Shell - Fuzhou Xinxu Technology Co., Ltd
Specifications
ODMOEM
shapeFlat
OriginChina
TechnicsSemiconductor IC
Model NO.8
Integration1
Conductive Type1
Transport PackageCarton
