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CategoriesIndustrial Equipment & ComponentsWelding & Soldering SuppliesOther Welding & Soldering SuppliesAusn Solder Ball for Mcroelectronics Packaging Such as BGA, SIP, Stacked Chip

Ausn Solder Ball for Mcroelectronics Packaging Such as BGA, SIP, Stacked Chip

Name: Ausn Solder Ball for Mcroelectronics Packaging Such as BGA, SIP, Stacked Chip
Brand: Guangzhou Xianyi Electronic Technology Co., Ltd.
SKU: LYgpJqdrYBWz
Price: 5 INR

5.0InStock Source-listed auditby Guangzhou Xianyi Electronic Technology Co., Ltd.

₹5≈ $0.06 · indicative, confirm with supplier

Payment

Description

Ausn Solder Ball for Mcroelectronics Packaging Such as BGA, SIP, Stacked Chip. High Purity Options: Available in Au80Sn20 and Au78Sn22 compositions for precise alloy requirements. Corrosion Resistance: Features high oxidation and corrosion resistance for reliable microelectronics packaging. 17 Years Experience: Manufacturer with 17 years of experience in solder preforms and solder balls. ISO Certified: Manufacturing facility certified with ISO9001:2015 and ISO14001 standards. Free Samples: Free samples available for testing purposes, with freight paid by the customer. OEM/ODM Support: Accepts OEM orders and offers full customization from samples or designs.