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Thermal Gap Pad Manufacturer, Thermal Graphite Sheet, Thermal Ceramic Supplier - Shenzhen Jia Rifeng Tai Electronic Technology Co., Ltd.
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Ain Ceramic Substrate with 190 Wmk for Electronic Semiconductor Component Tc027
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Description
Model NO.: TC027(190-200W) Application: Thermal Ceramic Material: Ain Ceramic Thermal Conductivity: 190-200W/M-K Volume Density: 3.32g/Cm³ Thermal Shock Resistance: None Crack
Specifications
TypeCeramic Plates
ColorDark Gray
OriginChina
Varpage≤2‰
MaterialAin Ceramic
Model NO.TC027(190-200W)
TrademarkJRFT
ApplicationThermal Ceramic
Roughness Ra0.3-0.5μm
Specification14*20mm, 17*22mm, etc
Volume Density3.32g/Cm³
Bending Strength335MPa
