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Customizable Amb Dbc Direct Bonded Copper Ceramic Substrate for Power Electronics with Metallized Gold Plated Copper Clad Layer
InStock Source-listed auditby Shenyang Vhandy Technology Co., Ltd
₹84≈ $1 · indicative, confirm with supplier
Supplier information
Description
Customizable Amb Dbc Direct Bonded Copper Ceramic Substrate for Power Electronics with Metallized Gold Plated Copper Clad Layer, Find Details and Price about Ceramic Substrate Metallized Ceramic Substrate from Customizable Amb Dbc Direct Bonded Copper Ceramic Substrate for Power Electronics with Metallized Gold Plated Copper Clad Layer - Shenyang Vhandy Technology Co., Ltd
Specifications
Warp≤200um
OriginChina
Density3.3G/Cm³
ProcessCustomizable
Aperture120-160 μm
MaterialAlN
Model NO.VH
ThicknessCustomizable
TrademarkOEM/ODM
Wetability≥95%
ApplicationElectronic Devices, Power Supply, Semiconductors
Resistivity10^14ω.Cm
