Thermally Conductive Polyurethane Materials for Potting and Encapsulation of Precision Electronic Components

Thermally Conductive Polyurethane Materials for Potting and Encapsulation of Precision Electronic Components. High Thermal Conductivity: Thermal conductivity of 0.55 W/m.K for efficient heat dissipation in electronic components. UL-94 V-0 Flame Retardant: Contains flame retardant additives meeting UL-94 V-0 standard for enhanced safety. Strong Adhesion: Adheres well to most metals and plastics with shear strength up to 6.5 MPa on aluminum. Solvent-Free Formula: Two-component polyurethane resin with no measurable volume change after curing.