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Shenzhen Ponda Professional Production Fully-Automatic Wafer Thinning Machine
5.0InStock Source-listed auditby Shenzhen Ponda Grinding Technology Co.,Ltd.
₹25,05,000≈ $30,000 · indicative, confirm with supplier
Payment
Description
Shenzhen Ponda Professional Production Fully-Automatic Wafer Thinning Machine, Find Details and Price about Thinning Machine Wafer Thinning Machine from Shenzhen Ponda Professional Production Fully-Automatic Wafer Thinning Machine - Shenzhen Ponda Grinding Technology Co.,Ltd.
Specifications
TypeSurface Grinding Machine
ObjectWafer
OriginChina
AbrasivesGrinding Wheel
ConditionNew
Model NO.300
PrecisionHigh Precision
TrademarkPONDA
ApplicationElectronic Technique
Package Size2500.00cm * 4500.00cm * 1800.00cm
Power SourceElectricity
CertificationISO 9001
