High-Stability Thermally Conductive Polyurethane/PU Adhesive for Electronic Device Potting

High-Stability Thermally Conductive Polyurethane/PU Adhesive for Electronic Device Potting. High Thermal Conductivity: Thermal conductivity reaches 0.55 W/m.K for efficient heat dissipation. UL-94 V-0 Flame Retardant: Contains flame retardant additives meeting UL-94 V-0 safety standards. Excellent Dielectric Properties: High dielectric strength of 20 kV/mm and low water absorption. Flexible & Strong Adhesion: Shore A 85 hardness with strong adhesion to metals and plastics. Solvent-Free Composition: Two-component polyurethane resin with no measurable volume change.