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Silica Heat Dissipation Sheet Thermal Conductive Interface Gap Filler for CPU
4.0InStock Source-listed auditby GUANGDONG DONGSEN ZHICHUANG TECHNOLOGY CO., LTD.
₹8≈ $0.1 · indicative, confirm with supplier
Payment
Description
Silica Heat Dissipation Sheet Thermal Conductive Interface Gap Filler for CPU, Find Details and Price about Thermal Rubber Pads Thermal Silicone Pad from Silica Heat Dissipation Sheet Thermal Conductive Interface Gap Filler for CPU - GUANGDONG DONGSEN ZHICHUANG TECHNOLOGY CO., LTD.
Specifications
ColorGrey
ShapeAcceptance Die Cutting Shape
OriginChina
Density1.8-5g/Cc
FeatureLow Thermally Resisitance
HS Code35069900
AdhesionAcceptance Back Strong Adhesion Glue
Hardness10-70 Shore C
Apply forCPU, LED Light, GPU, Consumer Electronics
CharacterLow Thermal Resistance Flexible and Soft
Fire FlamUL 94 V0
Model NO.heat rubber interface pad for led
