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High Thermal Conductivity Two-Component Polyurethane Structural Adhesive Bonding in The Electronics Industry
5.0InStock Source-listed auditby Shanghai Sepna Chemical Technology Co., Ltd.
₹8≈ $0.1 · indicative, confirm with supplier
Description
High Thermal Conductivity Two-Component Polyurethane Structural Adhesive Bonding in The Electronics Industry, Find Details and Price about 2K Adhesive Structural Adhesive from High Thermal Conductivity Two-Component Polyurethane Structural Adhesive Bonding in The Electronics Industry - Shanghai Sepna Chemical Technology Co., Ltd.
Specifications
TypeTwo Component
BrandSepna
ColorGreen
UsageBonding
Einecs210-898-8
OriginChina
SampleFree Samples
CAS No.9009-54-5
FormulaCH3h8n2o
HS Code3506100090
MaterialPolyurethane
AdvantageThermally Onductive
Model NO.
