Sck-202A Diamond Wire Cutting Machine Semiconductor Material Cutting Equipment

Sck-202A Diamond Wire Cutting Machine Semiconductor Material Cutting Equipment. Ultra High Cutting Precision Ultra Thin Slicing Supports ultra-thin wafer slicing down to 0.08 mm thickness (within 1-inch sample), ideal for TEM, optical and semiconductor thin slice preparation. Stable Constant Spring Tension Mechanism High rigidity spring tension wheel maintains constant tension during full cutting stroke, no tension fluctuation. Full-Automatic Continuous Cutting, Easy Operation Programmable automatic Y-axis continuous feeding; set cutting thickness, speed and stroke once, unattended batch slicing. Ultra-Wide Material Compatibility (Core Lab Advantage) Perfect for all brittle, hard, non-conductive & composite samples in material research: Optical crystals: Si, Ge, ZnSe, ZnS, sapphire, laser crys.