Custom Vapor Chamber for High Power Thermal Management

Custom Vapor Chamber for High Power Thermal Management. Customizable Dimensions: Shape, outline, thickness, and internal structure customizable based on drawings or samples. High Thermal Conductivity: Copper structure designed for rapid heat spreading and temperature uniformity in high power devices. Precision Micro-Structure: Supports dimple, groove, and etched structures for enhanced strength and heat transfer. OEM/ODM Capabilities: Full in-house capabilities including chemical etching, laser cutting, CNC machining, and brazing. Flexible Material Options: Available in C1100 Copper, OFHC Copper, stainless steel, aluminum, and other alloys. Low Volume Support: MOQ starts from 1 piece, supporting both rapid prototyping and mass production. Rapid Prototyping: 24-hour rapid prototyping available for simple designs depending on material and workload.