High-Speed Laser Direct Imaging Equipment Ldi Machine for Electronics Production PCB Assembly

High-Speed Laser Direct Imaging Equipment Ldi Machine for Electronics Production PCB Assembly. Sub-Micron Precision Control: Adopts sub-micron precision control platform and DMD technology for high imaging quality. Versatile Application Support: Suitable for MLB, HDI, FPC, and IC-Substrate Board anti-soldering and circuit patterns. Customizable Specifications: Maximum exposure size, substrate thickness, and line width are fully customizable. Advanced Laser Technology: Equipped with laser/UVLED + multi-wavelength laser for precise soldering process matching. Nanometer Positioning Accuracy: Ultra-precise air-floating drive control platform achieves hundreds of nanometers positioning. Global After-Sales Support: 24/7 technical assistance, spare parts supply, and on-site or remote training available. Cost-Effective Yield Improvement: Significantly increases yield and reduces overall costs through high-precision processes.