Low Viscosity Liquid Epoxy Encapsulant for Deep Potting of Electronic Modules

Low Viscosity Liquid Epoxy Encapsulant for Deep Potting of Electronic Modules. Excellent Insulation & Protection: Offers high breakdown voltage, moisture resistance, and electrical insulation for electronic modules. Self-Leveling Liquid Form: Room-temperature curing two-component epoxy with self-leveling properties for deep potting. Flame Retardant Grade V0: Meets UL94 V0 standard for enhanced fire safety in high-power electronic applications. Customization Available: Viscosity, curing time, and strength can be tailored to specific industrial requirements. Solvent-Free & Eco-Friendly: Environmentally friendly, low-carbon, and non-corrosive formulation for safe usage. Superior Weather Resistance: Excellent aging resistance, UV resistance, and shock resistance for long-term durability. Fast Curing Time: Full curing achieved within 48 hours at room temperature for efficient production cycles.