High-Conductivity C19210 Cufe0.1p Strip for Lead Frame & Terminals

High-Conductivity C19210 Cufe0.1p Strip for Lead Frame & Terminals. C19210 forms nano-cale Fe2P precipitates for strengthening; retains ultra-high conductivity 85-90%IACS, much higher than phosphor bronze and Cu-Ni-Si alloys. Good high-temperature stress-relaxation resistance, maintains stable contact force under 120-150 continuous service; effectively restrains contact-resistance drift of power terminals. Excellent cold forming & stamping performance, good small-R-angle bending property; high yield for ultra-thin miniaturized lead-frame and complex terminal structures. High softening temperature, resists performance degradation during SMT reflow and short-time welding; suitable for electronic components with subsequent high-temperature assembly process. Good solderability and plating compatibility; tin, nickel and gold plating obtain firm adhesion, perfectly matching semiconductor packaging and automotive electronic assembly. Flat strip surface, tight thickness tolerance, low outgassing; stable batch consistency, ideal mass-production material for semiconductor and new-energy electrical parts.