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Professional Multilayer Printed Circuit-Boards China FPC Manufacturer. Advanced Via Technology: Features blind/buried vias, HDI micro vias, and via-in-pad with solid copper filling. Heavy Copper Capability: Supports heavy-copper up to 12oz for high current applications. Large Board Dimensions: Maximum board thickness up to 6.5mm and size up to 1010x610mm. Strict Quality Standards: Manufactured to the strictest UL and IPC standards with state-of-the-art equipment. Customizable Solder Mask: Available in Green, White, Black, Blue, Red with customized options. Fast Delivery Time: Standard delivery within 24 hours to 5 days. Low MOQ Requirement: Minimum order quantity starts at just 1 piece.