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Integrated Hot Press Bonding Function Semiconductor High-Speed and High-Precision Solidification Machine
InStock Source-listed auditby Suzhou Bozhon Semiconductor Co., Ltd
₹83,50,000≈ $100,000 · indicative, confirm with supplier
Supplier information
Description
Integrated Hot Press Bonding Function Semiconductor High-Speed and High-Precision Solidification Machine, Find Details and Price about Die Bonder and Die Bonding from Suzhou Bozhon Semiconductor Co., Ltd.
Specifications
SpeedHigh Speed
ConditionNew
Model NO.DU9721
PrecisionHigh Precision
After-sales Service7*24 Hour After-Sales Service
