
Room-Temperature Curing High-Temperature Resistant Thermal Conductive Epoxy Potting Adhesive Is Suitable for Potting and Waterproofing of Electric Motors. High Thermal Conductivity: Achieves 1.0 W/mK thermal conductivity for efficient heat dissipation in electronic components. Superior Adhesion: Provides strong bonding with anti-cracking properties and excellent adhesion to various substrates. Low Water Absorption: Features very low water absorption, ensuring good waterproof and moisture resistance performance. Low CTE Performance: Low linear thermal expansion coefficient reduces stress on components during temperature changes. Multi-Industry Application: Suitable for automotive, electronics, power tools, and machinery potting and waterproofing needs.