Semiconductor Wafer Double Side Lapping Equipment

Name: Semiconductor Wafer Double Side Lapping Equipment
Brand: Nanjing Bangwin Thermal Equipment Co., Ltd.
SKU: wUmRCIdbGFWO
Price: 542750 INR

5.0InStock Source-listed auditby Nanjing Bangwin Thermal Equipment Co., Ltd.

₹5,42,750≈ $6,500 · indicative, confirm with supplier

Payment

LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram

Incoterms

FOB, EXW, CFR, CIF, DAT, FAS, DDP, DAP, CIP, CPT, Others, FCA

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Description

Semiconductor Wafer Double Side Lapping Equipment. Integrated Grinding Process: Achieves both rough and fine grinding in a single integrated operation. High Precision Control: Utilizes PLC, grating ruler, and servo control for fully closed-loop thickness management. Stable Operation: Designed with high processing precision and stable operational performance. Versatile Spindle Design: Lower spindle switches between rough grinding and fine grinding positions. Complete Production Line: Capable of building a complete silicon wafer production line. Global Certifications: Certified with GS, CE, RoHS, and ISO 9001 standards. Flexible Payment Options: Accepts LC, T/T, D/P, PayPal, Western Union, and other payment methods. Fast Lead Time: Average lead time within 15 working days for both peak and off-peak seasons.