Copper Tungsten Cuw or Wcu Heat Sinks and Electronic Packaging Materials

Copper Tungsten Cuw or Wcu Heat Sinks and Electronic Packaging Materials. Wide Composition Range: Available from Cu 50 wt.% to Cu 90 wt.% with ratios like 70/30, 75/25, 80/20, 90/10. Customizable Dimensions: Diameter from 1.0mm to 127mm+; Thickness from 0.05mm to 50mm; shapes by drawing. High Thermal Conductivity: Superior thermal conductivity ranging from 180 to 230 W/m-K depending on composition. Arc Erosion Resistance: Excellent resistance to high-temperature and arc-erosion for long electrode life. Low Thermal Expansion: Tailorable coefficient of thermal expansion matching SiC and ceramic substrates. ISO 9001 Certified: Manufacturer is ISO-accredited with over 28 years of experience in quality production. Diverse Product Forms: Available as wire, rod, bar, strip, foil, plate, tube, and custom machined parts. Conflict-Free Material: Manufactures and supplies DRC Conflict Free tungsten alloy materials only.