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Heat-Resistant Thermal-Stable Low-Profile Circuit Board Flexible FPC BGA Assembly for MRI Scanner
5.0InStock Source-listed auditby Shenzhen Huaxia Zhike Technology Co., Ltd.
₹84≈ $1 · indicative, confirm with supplier
Description
Heat-Resistant Thermal-Stable Low-Profile Circuit Board Flexible FPC BGA Assembly for MRI Scanner, Find Details and Price about FPC Flexible FPC from Heat-Resistant Thermal-Stable Low-Profile Circuit Board Flexible FPC BGA Assembly for MRI Scanner - Shenzhen Huaxia Zhike Technology Co., Ltd.
Specifications
OriginChina
Lead Time15 days (1 - 1000 Pieces) To be negotiated ( > 1000 Pieces)
Model NO.circuit_board_162
Package Size25.00cm * 15.00cm * 15.00cm
Back Adhesive3m 467MP / 9448A High Temp. Resistant & High Bond
Base MaterialCopper
SpecificationCustomized
Coverlay ColorAmber (Yellow), Black, White, Customized
Transport PackageWooden Box
Stiffener MaterialPi / Fr4 / Stainless Steel (SUS)
Production Capacity500000
