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Semiconductor Wafer Edge Grinding Machine for Silicon Processing
5.0InStock Source-listed auditby Nanjing Bangwin Thermal Equipment Co., Ltd.
₹5,84,500≈ $7,000 · indicative, confirm with supplier
Payment
L/C, T/T, D/P, Western Union, Paypal, Money Gram
Port
Shanghai, China
Incoterms
FOB, EXW, CFR, CIF, DAT, FAS, DDP, DAP, CIP, CPT, Others, FCA
Description
Semiconductor Wafer Edge Grinding Machine for Silicon Processing, Find Details and Price about Wafer Edge Profiling Machine IC Wafer Edge Grinding Machine from Semiconductor Wafer Edge Grinding Machine for Silicon Processing - Nanjing Bangwin Thermal Equipment Co., Ltd.
Specifications
StyleDesktop
OriginChina
AutomaticAutomatic
Model NO.bw
TrademarkN/A
Power (Kw)2
Weight (Kg)350
Package Size100.00cm * 100.00cm * 100.00cm
CertificationGS, CE, ISO
Specification1560x700x940mm
Adhesion ForceBetter Than -80kpa
Grinding Speed1mm/S-50mm/S
