Strong High Performance Polyimide Adhesive Tape for Heat Press and Flexible Circuit

Strong High Performance Polyimide Adhesive Tape for Heat Press and Flexible Circuit. Superior Heat Press Performance: Withstands the high temperatures and pressures of heat press bonding, ensuring consistent adhesion throughout the cycle. Strong Bond on Flexible Circuits: The silicone adhesive grips well to polyimide, copper, and other flexible substrate materials, providing reliable connections. Thin and Conformable: At typical 0.05mm thickness, the film easily wraps around flexible circuits and small components without adding bulk. Residue Free Unwrapping: Peels off cleanly after hot pressing, leaving no sticky traces on heat platens or flexible assemblies. Versatile Shop Assistant: Useful for heat transfer, flexible PCB repair, wire harness bundling, and general high temperature masking. Quick to Cut and Apply: You can tear it by hand to any required length, speeding up your workflow and reducing material waste.