PCB Assembly AG100 Solder Preforms High Reliability Less Residue

PCB Assembly AG100 Solder Preforms High Reliability Less Residue. High Reliability Material: 100% pure silver Ag100 preforms with superior thermal and electrical conductivity. Low Residue Flux Core: Flux-cored wire design ensures less residue and cleaner soldering joints. Customizable Dimensions: Diameter and package are fully customizable to meet specific application needs. International Certifications: Products pass ROHS and REACH testing with available SGS certificates. ODM and OEM Services: Full customization options including samples, designs, and flexible customization. Rapid Lead Time: Average lead time within 15 workdays for both peak and off-peak seasons. ISO Certified Process: Manufacturing operates under ISO-certified processes for consistent quality. Global Supply Chain: Robust logistics network with Shenzhen port shipping and worldwide delivery.