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Bozhong High-Precision Solidification Machine Adopts Eutectic and Dipping Process Methods
InStock Source-listed auditby Suzhou Bozhon Semiconductor Co., Ltd
₹83,50,000≈ $100,000 · indicative, confirm with supplier
Supplier information
Description
Bozhong High-Precision Solidification Machine Adopts Eutectic and Dipping Process Methods, Find Details and Price about Die Bonder Die Bonding from Bozhong High-Precision Solidification Machine Adopts Eutectic and Dipping Process Methods - Suzhou Bozhon Semiconductor Co., Ltd
Specifications
TypeHigh-speed Chip Mounter
SpeedHigh Speed
Nozzle12 Nozzles Per Head, with Dynamic Tool Change
OriginChina
Weights2200kg
Warranty12 Months
ConditionNew
Model NO.EF8621
PrecisionHigh Precision
TrademarkSuzhou Bozhon Semiconductor Co
CertificationISO, CE
Specification1900mm*1100mm*1800mm
