Thin Diamond Wire Saw for Stone Cutting

Thin Diamond Wire Saw for Stone Cutting. Customized Special Diamond Wire: Developed based on customer needs for stronger cutting capacity and stability. High Cutting Efficiency: High hardness diamond particles ensure flat, smooth surfaces and efficient cutting. Long Service Life: Electroplating process ensures firm attachment, reducing diamond shedding and replacement frequency. Wide Application Range: Suitable for stone, ceramics, glass, and semiconductor silicon wafers. Easy Operation: High flexibility allows precise cutting in complex paths with user-friendly technical requirements. Multiple Diameter Options: Available in 0.45mm, 0.50mm, 0.55mm, and 0.60mm for precision or rapid cutting.