Efficient 6W/M. K Thermal Insulation Pad for Computer Processors

Efficient 6W/M. K Thermal Insulation Pad for Computer Processors. High Thermal Conductivity: 6W/m.K thermal conductivity ensures efficient heat dissipation for computer processors. Customizable Properties: Fully customizable in thermal conductivity, size, thickness, shape, and color. Excellent Flame Rating: Meets UL V0 flame rating standards for enhanced safety. Flexible & Soft Design: Softness and flexibility ensure excellent surface conformity and low thermal resistance. Multi-Function Performance: Provides insulation, vibration damping, and sealing for miniaturized devices. High Tensile Strength: Features excellent tensile strength for durability and mechanical stability. OEM/ODM Services: Offers full customization, minor customization, and flexible customization options.