Blind & Buried Via HDI PCB Micro Vias Down to 0.1mm High-Density Interconnect for Smartphones & IoT Modules

Blind & Buried Via HDI PCB Micro Vias Down to 0.1mm High-Density Interconnect for Smartphones & IoT Modules. Customized PCB Layers: Supports 1 to 26 layers with full customization options. HDI Micro Vias Capability: Enables blind and buried vias down to 0.1mm for high-density interconnects. Comprehensive Certifications: ISO9001, UL, RoHS, and ISO14000 certified for global compliance. One-Stop PCB Solution: Offers complete PCB manufacturing and assembly services including SMT and DIP. Fast Prototype Delivery: PCB prototypes delivered in 1-6 days depending on layer count. Small Order Acceptance: Accepts orders as low as 1 piece or panel for prototyping. Global Export Experience: Serves customers in over 40 countries with 70% exports to US and Europe.