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Impedance-Controlled Blind-Via Buried-Via High-Density Rigid Electronic Prototype Board Assembly Custom Multilayer PCB
5.0InStock Source-listed auditby SINING TECHNOLOGY (SHENZHEN) CO., LTD
₹2
Description
Impedance-Controlled Blind-Via Buried-Via High-Density Rigid Electronic Prototype Board Assembly Custom Multilayer PCB, Find Details and Price about Multilayer PCB Assemble Multilayer PCB from Impedance-Controlled Blind-Via Buried-Via High-Density Rigid Electronic Prototype Board Assembly Custom Multilayer PCB - SINING TECHNOLOGY (SHENZHEN) CO., LTD
Specifications
BrandCustomized
OriginChina
HS Code8413910000
MaterialComplex
Lead Time10 days (1 - 1000 Pieces) 20 days (1001 - 10000 Pieces) To be negotiated ( > 10000 Pieces)
Model NO.SNT- Multilayer PCB -06006
TrademarkSNTPCB
ApplicationConsumer Electronics
Package Size30.00cm * 50.00cm * 30.00cm
Base MaterialCopper
SpecificationCustomized OEM
Mechanical Rigid
