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High-Aspect-Ratio (10: 1) Blind Vias on Heavy Copper (12oz) PCBA Pulse Reverse Plating for Uniform Deposition Power Distribution for Substations
5.0InStock Source-listed auditby Fastline Circuits Co., Limited
Description
High-Aspect-Ratio (10: 1) Blind Vias on Heavy Copper (12oz) PCBA Pulse Reverse Plating for Uniform Deposition Power Distribution for Substations, Find Details and Price about High-Aspect-Ratio Blind Vias from High-Aspect-Ratio (10: 1) Blind Vias on Heavy Copper (12oz) PCBA Pulse Reverse Plating for Uniform Deposition Power Distribution for Substations - Fastline Circuits Co., Limited
Specifications
LayersMultilayer
OriginShenzhen, China
HS Code8534009000
ConditionUsed
Lead Time12-20 Days
Model NO.pcb
PCB Layer1-26 Layers
TrademarkFastline
CustomizedCustomized
PCB ServiceOne Stop Service
Silk ScreenWhite
Solder MaskGreen
