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High Density Interconnect HDI PCBA Assembly with Fine Pitch BGA for Edge Devices
5.0InStock Source-listed auditby Yuwei Electronic Technology (Wuhan) Co., Limited
₹251≈ $3 · indicative, confirm with supplier
Payment
Description
High Density Interconnect HDI PCBA Assembly with Fine Pitch BGA for Edge Devices, Find Details and Price about HDI PCBA High Density Interconnect PCBA from High Density Interconnect HDI PCBA Assembly with Fine Pitch BGA for Edge Devices - Yuwei Electronic Technology (Wuhan) Co., Limited
Specifications
SizeCustomized
LayersMultilayer
OriginChina
ServicePCB Design/Fabrication/Component/Assembly
TestingFly-Probe/Aoi/100%Function Testing
ConditionNew
Model NO.YW-RT-091116
TrademarkYUWEI ELECTRONIC
CustomizedCustomized
SilkscreenBlack.White.Yellow.Red.Blue Custom
Layer Count1-50L
Solder MaskGreen.Black.Red.Yellow.White.Blue Custom
